Ipc-7095 Pdf ✦ Instant

The standard provides for voids (gas pockets) within BGA solder balls:

Laminating the voiding percentage charts saves your inspectors from having to flip through 90 pages. Circle the limits applicable to your customer's class (Class 1, 2, or 3). ipc-7095 pdf

Techniques and criteria for inspecting and testing assemblies with CSPs and BGAs. This includes guidelines for visual inspection, x-ray inspection, and electrical testing to verify the integrity and performance of the solder joints and the components. The standard provides for voids (gas pockets) within

Because BGA joints are hidden, the process must be strictly controlled to ensure "quality by design". ipc-7095 pdf